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"# !" " !!# ! ! the MPXM2102 device is a silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output e directly proportional to the applied pressure. the sensor is a single, monolithic silicon diaphragm with the strain gauge and a thinfilm resistor network integrated onchip. the chip is laser trimmed for precise span and offset calibration and temperature compensation. features ? temperature compensated over 0 c to +85 c ? available in easy-to-use tape & reel ? ratiometric to supply voltage ? gauge ported & non ported options application examples ? pump/motor controllers ? robotics ? level indicators ? medical diagnostics ? pressure switching ? barometers ? altimeters figure 1 shows a block diagram of the internal circuitry on the standalone pressure sensor chip. figure 1. temperature compensated pressure sensor schematic ) & +08/15 &!& ! !' ' ! ' #%'(% " #!&' "! ! %' "! %( '%,
) 487 ) 487 ! voltage output versus applied differential pressure the differential voltage output of the sensor is directly proportional to the differential pressure applied. the output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (p1) relative to the vacuum side (p2). similarly, output voltage increases as increasing vacuum is applied to the vacuum side (p2) relative to the pressure side (p1). preferred devices are motorola recommended choices for future use and best overall value. order this document by MPXM2102/d semiconductor technical data ? motorola, inc. 2001 0 to 100 kpa (0 to 14.5 psi) 40 mv full scale span (typical) pin number 1 2 gnd +v out 3 4 v s v out motorola preferred device case 1320 case 1320a mpak package rev 1 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (note) rating symbol value unit maximum pressure (p1 > p2) p max 200 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 10 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range (1) p op 0 e 100 kpa supply voltage (2) v s e 10 16 vdc supply current i o e 6.0 e madc full scale span (3) v fss 38.5 40 41.5 mv offset (4) MPXM2102d/g series MPXM2102a series v off 1.0 2.0 e e 1.0 2.0 mv sensitivity d v/ d p e 0.4 e mv/kpa linearity (5) MPXM2102d/g series MPXM2102a series e e 0.6 1.0 e e 0.4 1.0 %v fss pressure hysteresis (5) (0 to 100 kpa) e e 0.1 e %v fss temperature hysteresis (5) (40 c to +125 c) e e 0.5 e %v fss temperature effect on full scale span (5) tcv fss 2.0 e 2.0 %v fss temperature effect on offset (5) tcv off 1.0 e 1.0 mv input impedance z in 1000 e 2500 w output impedance z out 1400 e 3000 w response time (6) (10% to 90%) t r e 1.0 e ms warmup e e 20 e ms offset stability (7) e e 0.5 e %v fss notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. operating the device above the specified excitation range may i nduce additional error due to device selfheating. 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. 5. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 3 motorola sensor device data linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 2) or (2) a least squares best line fit. while a least squares fit gives the abest caseo linearity error (lower numerical value), the calculations required are burdensome. conversely, an end point fit will give the aworst caseo error (often more desirable in error budget calculations) and the cal- culations are more straightforward for the user. motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. linearity specification comparison &' &$(% ) ' "! % ' ))" ' "('#(' #%&&(% ( & ! #" !' &'% ' ! ' + %' #%"% ! (%) &' &$(%& ' &'% ' ! ) ' "! "&' onchip temperature compensation and calibration figure 3 shows the minimum, maximum and typical output characteristics of the MPXM2102 series at 25 c. the output is directly proportional to the differential pressure and is es- sentially a straight line. a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. figure 3. output versus pressure differential "('#('3)0/ 2#- #& 9 &#! %! ',# "&' ',# ',# ! ) & )0/ ' # # + ordering information device type options case type device type options c ase t ype MPXM2102d nonported 1320 MPXM2102dt1 nonported, tape and reel 1320 MPXM2102gs ported 1320a MPXM2102gst1 ported, tape and reel 1320a MPXM2102a nonported 1320 MPXM2102at1 nonported, tape and reel 1320 MPXM2102as ported 1320a MPXM2102ast1 ported, tape and reel 1320a f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 4 motorola sensor device data package dimensions case 132002 issue a mpak, style 1 & & q !"'& !& "!& % ! ! & !'%#%' !& "!& ! '" %!& #% & , !& "!& ! " !"' ! ( " & "% #%"'%(& "! " & "% #%"'%(& "! & !"' + #% & )%' &(%& '" + ( !& "!& . "& !"' ! ( % #%"'%(& "! "* % #%"'%(& "! & + ( b1 e e/2 e b e1 a c detail e detail e l a1 q .014 b d a &', # ! ! )487 )6 )487 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 5 motorola sensor device data package dimensions (continued) case 1320a02 issue o mpak, style 1 & & q !"'& !& "!& % ! ! & !'%#%' !& "!& ! '" %!& #% & , !& "!& ! " !"' ! ( " & "% #%"'%(& "! " & "% #%"'%(& "! & !"' + #% & )%' &(%& '" + ( !& "!& . "& !"' ! ( % #%"'%(& "! "* % #%"'%(& "! & + ( b1 e e/2 e b e1 a c detail e detail e l a1 q .014 b d a n s p f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 6 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 7 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 8 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the applicati on or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operatin g parameters, including at ypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under it s patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical imp lant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expens es, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola, inc. motorola, inc. is an equal opportunity/a ffirmative action employer. motorola and the logo are registered in the us patent & trademark office. all other product or service names are the property of t heir respective owners. motorola, inc. 2001. how to reach us: usa/europe/locations not listed : motorola literature distribution; p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 japan : motorola japan ltd.; sps, technical information center, 3201, minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong ko ng. 85226668334 technical information center: 18005216274 home page : http://www.motorola.com/semiconductors/ MPXM2102/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . |
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